Thermal conductive tape is made of acrylic polymer filled with thermally conductive ceramic powder and compounded with silicone adhesive. This product has high thermal conductivity and insulation properties, and has softness, compression, conformity, and strong viscosity. Its thermal conductivity is high and stable, especially for electronic and electrical products, and plays a protective role in heat dissipation.
　　
Thermally conductive double-sided adhesive tape solves the problem of bonding of chips, flexible circuit boards, high-power transistors, heat sinks or other cooling devices in electronic appliances, LED lighting, hardware industry, printing industry and other manufacturing industries..It can adapt to a wide range of temperatures, can fill uneven surfaces, can closely and firmly fit heat source devices and heat sinks, and conduct heat quickly, thereby increasing components. stability and service life.

Thermal conductive tape, also known as thermal adhesive tape, is a type of adhesive tape designed to provide efficient heat transfer between two surfaces. It is used to bond components or heat sinks to electronic devices or other surfaces, enhancing thermal conductivity and heat dissipation. Here are some key features and common uses of thermal conductive tape:
　　
Features:
1. Thermal Conductivity: Thermal conductive tape is engineered with materials that have high thermal conductivity, such as thermally conductive adhesives or compounds filled with ceramic or metal particles. This allows for efficient heat transfer across the tape.
2. Adhesive Properties: Thermal conductive tape is typically coated with a strong adhesive on both sides. The adhesive provides secure bonding between surfaces, ensuring good thermal contact and minimizing air gaps that can hinder heat transfer.
3. Flexibility and Conformability: Thermal conductive tape is designed to be flexible and conformable, allowing it to conform to uneven or curved surfaces. This ensures maximum contact and heat transfer between the tape and the components or heat sinks.
4. Electrical Insulation: Thermal conductive tape is often electrically insulating, which helps prevent short circuits and electrical interference when used in electronic applications.
5. Heat Resistance: Thermal conductive tape is designed to withstand high temperatures without melting or degrading its thermal conductivity properties. It can operate reliably at elevated temperatures typically encountered in electronic devices.
　　
Common Uses:
1. Electronic Devices: Thermal conductive tape is widely used in electronic devices to improve heat dissipation. It is commonly applied to bond heat sinks, thermal pads, or other heat-generating components to circuit boards, power modules, LED devices, or integrated circuits (ICs).
2. Computer and CPU Cooling: Thermal conductive tape is utilized in computer systems for cooling purposes. It is often used to attach heat sinks or thermal modules to CPUs, GPUs (graphics processing units), or other heat-generating components to enhance heat transfer and improve cooling efficiency.
3. LED Lighting: Thermal conductive tape is employed in LED lighting systems to bond heat sinks or thermal pads to LED modules or drivers. It helps dissipate heat generated by LEDs, preventing overheating and prolonging their lifespan.
4. Automotive Electronics: Thermal conductive tape finds application in automotive electronics, such as control modules, sensors, or power electronics. It helps improve heat dissipation and thermal management in these components, ensuring optimal performance and reliability.
5. Power Electronics: Thermal conductive tape is used in power electronic devices, including inverters, converters, or power modules. It facilitates heat transfer from high-power components to heat sinks, improving thermal efficiency and preventing overheating.
　　
It's important to choose the appropriate thermal conductive tape based on the specific application requirements, such as desired thermal conductivity, thickness, adhesive strength, temperature range, and compatibility with the surfaces being bonded.